Flexisign Pro 81v1 Crack
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How to link a printer to Flexisign software. Click on this URL. I’m sure it will help you. Flexisign Pro 81v1 Crack.18.104.22.168.Japanese patent application Ser. No. 57-6364 filed on Feb. 11, 1982 discloses an apparatus for transferring a chip such as a semiconductor wafer having a diametrical dimension of 300-600 mm and a thickness of 100-150 mm to a supporting table by using a suction sheet and a movable chuck for supporting one side of the suction sheet.
FIG. 1 shows such apparatus disclosed in the above cited Japanese patent application. The apparatus includes a base 61 and a cover 62 that is rotatably mounted on the base 61 for opening and closing a top opening of the apparatus. A table 63 is arranged on a bottom of the apparatus in such a manner as to be supported by the base 61 and a cover 62.
A suction sheet 71 is arranged between the table 63 and the base 61 so as to be movable upward and downward and is attached to the table 63. A clamp plate 74 is attached to a bottom of the suction sheet 71, and a suction pipe 75 connected to the suction sheet 71 is provided in a suction face 74a of the clamp plate 74 to serve as a vacuum pump.
A supporting plate 76 is attached to the bottom of the table 63 so as to be movable upward and downward and is placed above the suction sheet 71. A supporting member 77 is attached to a bottom of the supporting plate 76 so as to be vertically movable upward and downward. A movable chuck 78 is attached to the supporting member 77 so as to be vertically movable. A chuck base 79 is attached to the movable chuck 78 for supporting a front side of the movable chuck 78.
A connecting bar 72 is attached to the supporting
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