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Conventionally, a die is bonded to a structure that provides a physical and electrical connection to external devices, and the resulting assembly of die and substrate structure is then encapsulated in a plastic package that protects the die from harmful environmental conditions and provides a surface for connection to the external devices. In some instances, the leadframe of a package can be constructed to include the package substrate, and in such instances, the package may be referred to as an “embedded” package. In other instances, a leadframe can be constructed to include a die that has a lower profile than the profile of the die package substrate, and thus the die is not embedded within the package, but rather is generally “external” or “off-chip” of the package. The leadframe can also be fabricated having various smaller-scale or more complex patterning (e.g., finer pitch, additional leads, and/or other features) so as to provide a specific electrical circuit for connection with an external device.
For a variety of reasons, some ICs are “flip-chip” or “flip-chip-like” devices, and in such an IC, the die is typically provided with a series of metallic terminals or contacts (“bumps” or “balls”) on the upper surface of


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