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Nunas Desnudas Fotos Desnudas Chiquitas. XNXX is the best porn site on the web. semiconductor integrated circuit (IC) typically has one or more “chips” formed in an integrated circuit die. A chip includes a variety of circuit elements (e.g., memory storage cells, processors, etc.) that are fabricated in a well-defined arrangement on a wafer surface, and which extend in a given direction across the surface. In the case of an electrical chip, such as a computer processor, the circuit elements are fabricated on an appropriately doped silicon wafer that is “thinned” to a desired thickness, followed by a series of photolithographic masking steps to create circuit elements (e.g., transistors and memory cells) that are interconnected with one another to define a desired function.
Conventionally, a die is bonded to a structure that provides a physical and electrical connection to external devices, and the resulting assembly of die and substrate structure is then encapsulated in a plastic package that protects the die from harmful environmental conditions and provides a surface for connection to the external devices. In some instances, the leadframe of a package can be constructed to include the package substrate, and in such instances, the package may be referred to as an “embedded” package. In other instances, a leadframe can be constructed to include a die that has a lower profile than the profile of the die package substrate, and thus the die is not embedded within the package, but rather is generally “external” or “off-chip” of the package. The leadframe can also be fabricated having various smaller-scale or more complex patterning (e.g., finer pitch, additional leads, and/or other features) so as to provide a specific electrical circuit for connection with an external device.
For a variety of reasons, some ICs are “flip-chip” or “flip-chip-like” devices, and in such an IC, the die is typically provided with a series of metallic terminals or contacts (“bumps” or “balls”) on the upper surface of